AIM offers a broad range of solders to fulfill your most challenging component packaging applications.We offer solders for:
- Fibre to Ferrule Soldering
- Laser Die Attach
- Hermetic Packaging & Sealing
- Wetting & Sealing Laser Optics
- Thermal Management
The AIM Solder Test Kit allows you to experiment with a broad range of alloys to find the most suitable solution for your Photonic Packaging assembly process- without having to purchase large quantities of several products.
The AIM Solder Test Kit contains solder wires in six alloys proven to be suitable for a variety of applications. These include lead-free, gold-tin and indium-based solders with various physical characteristics and melting points ranging from 118° to 280°C.
Further information on AIM’s solders for photonic packaging may be found here.
