AIM’s full range of specialty joining materials includes indium and gold/tin solders for photonic packaging applications. When you work with AIM you receive superior products & the technical support you need to produce innovative and reliable packaging solutions. AIM offers a broad range of solders to fulfill your most challenging component packaging applications.
We offer solders for:
- Fiber to Ferrule Soldering
- Laser Die Attach
- Hermetic Packaging & Sealing
- Wetting & Sealing Laser Optics
- Thermal Management
Solder alloys for photonic packaging applications include indium, gold, bismuth, cadmium, and gallium based solder alloys. Please click on any of the above metals to display additional information on their alloys.
The chart below lists a selection of AIM’s most commonly specified solder alloys used in photonic packaging applications.
| Alloy Composition |
Melting Range (°C) |
Tensile Strength (ksi) |
Density (g/cm3) |
CTE (x10-8 / °C) |
Creep Resistance |
|
80Au/20Sn |
280 |
276 |
14.5 |
16 |
Excellent |
|
88Au/12Ge |
356 |
185 |
14.7 |
13 |
Excellent |
|
96.5Sn/3.5Ag |
221 |
38 |
7.36 |
21 |
High |
|
95Sn/3.5Ag/1.5In |
218 |
51 |
7.36 |
22 |
High |
|
91Sn/9Zn |
199 |
65 |
7.27 |
n/a |
Good |
|
63Sn/Pb37 |
183 |
32 |
8.40 |
25 |
Moderate |
|
62Sn/Pb36/Ag2 |
179 |
46 |
8.41 |
27 |
High |
|
CASTIN |
217 |
40 |
7.30 |
40 |
High |
|
SAC305 |
218 |
40 |
7.40 |
40 |
High |
|
40In/60Pb |
195-225 |
34.5 |
9.31 |
26 |
Moderate |
|
70In/30Pb |
160-174 |
23.8 |
8.19 |
28 |
Moderate |
|
80In/Pb15/Ag5 |
148-149 |
17.5 |
7.85 |
26 |
Moderate |
|
100In |
156.7 |
2.5 |
7.31 |
29 |
Poor |
|
97In/3Ag |
146 |
5.5 |
7.38 |
22 |
Poor |
|
52In/48Sn |
118 |
11.9 |
7.30 |
24 |
Low |
|
58Bi/42Sn |
138 |
55 |
8.56 |
14 |
Moderate |
|
40Bi/60Sn |
138-170 |
n/a |
8.12 |
14 |
Moderate |
|
54Sn/26Pb/20In |
138-150 |
n/a |
8.10 |
25 |
Moderate |
|
35.7Sn/35.7Pb/28.6Bi |
100 |
24 |
9.34 |
20 |
Low |
