Description:
NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability of NC257-2 results in bright, smooth and shiny solder joints, and it has been specifically formulated to lower solder beading. It also offers very low post process residues, which remain crystal clear and easily probed even at the elevated temperatures required for today’s lead-free alloys.
This solder paste offers a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useable life in facilities where environmental control is not at its optimum.
Lead-Free No Clean Solder Paste Features:
- RoHS Compliant
- Vapor Phase Compatible
- Excellent Wetting
- Broad Printing Process Window
- Low-Tombstoning
- No Head-in-Pillow
- Clear Pin–Probe Testable Residue
- 24 Hour Stencil Life
- 12-14 Hour Tack Time
- Reduces Voiding Under Micro-BGAs
- Low Solder Beading
- General Metal Load 88.5%
Printing:
- Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16 mm (½ to ⅝ inch) is normally sufficient to begin).
- Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties.
- NC257-2 provides the necessary tack time and force for today’s high speed placement equipment, which will enhance product performance and reliability.
- Cleaning of your stencil will vary by application; however, it can be accomplished using AIM 200AX-10 stencil cleaner.
| RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN | |||
| PARAMETER | RECOMMENDED INITIAL SETTINGS | PARAMETER | RECOMMENDED INITIAL SETTINGS |
| Squeegee Pressure | 0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade | PCB Separation Distance | 0.75-2.0 mm (.030-.080”) |
| Squeegee Speed | 12-150 mm/sec (.5-6”/sec) | PCB Separation Speed | Slow |
| Snap-off Distance | On Contact 0.00 mm (0.00”) | ||
Reflow Profile:
Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and they each have similar reflow temperatures. The two profiles differ in where they reach their respective peak temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller assemblies, where as the longer profile would apply to larger assemblies, such as backplanes or high-density boards. The shaded area defines the process window. Oven efficiency, board size/mass, component type and density all influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermal-couples attached is recommended to optimize the process.
|
RATE OF RISE 2°C / SEC MAX
|
RAMP TO 150°C (302°F)
|
PROGRESS THROUGH 150°C-175°C (302°F-347°F)
|
TO PEAK TEMP 230°C-245°C (445°F- 474°F)
|
TIME ABOVE 217°C (425°F)
|
COOLDOWN ≤ 4 °C / SEC
|
PROFILE LENGTH AMBIENT TO PEAK
|
|
Short Profiles
|
≤ 75 Sec
|
30-60 Sec
|
45-75 Sec
|
30-60 Sec
|
45± 15 Sec
|
2.75-3.5 Min
|
|
Long Profiles
|
≤ 90 Sec
|
60-90 Sec
|
45-75 Sec
|
60-90 Sec
|
45± 15 Sec
|
4.5-5.0 Min
|
- THE RECOMMENDED REFLOW PROFILE FOR NC257-2 IS PROVIDED AS A GUIDELINE. OPTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE, ASSEMBLY LAYOUT, OR OTHER PROCESS VARIABLES. CONTACT AIM TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE.
- THE REFLOW PROFILE FOR THE SnAgCu PASTES USING A VAPOR PHASE REFLOW OVEN: PEAK TEMPERATURE RANGE IS 230°C – 245°C.
