Solder Paste

AIM Australia offers a wide variety of flux types and solder alloys, including Leaded Solder Paste alloys and Lead-Free Solder Paste alloys.
If you cannot find the product you are looking for, please send us a request.

AIM Australia's Lead-Free Solder Pastes are available in a variety of chemistries, alloys, powder mesh size, and packaging and offer the following features:

  • Excellent printability and tack force
  • Long tack time and stencil life
  • Excellent wetting and solderability
  • Low residues
  • Easily cleaned residues
  • Pass Bellcore and IPC reliability testing
  • Easily pin probe tested
  • High heat and humidity resistance
  • Suitable for high-speed printing
  • Eliminate solder defects such as voiding and solder beading

If you wish to buy solder cream / buy solder paste or any other solder assembly materials for the electronics industry, click the following link to access a list of AIM Products Australian Resellers or call us on 02 4735 3126

WS353 SAC305 Lead Free Water Soluble Solder Paste

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Description:

WS353 water soluble solder paste has been developed in response to electronics manufacturers demand for an all-purpose, reliably consistent water-soluble solder paste. WS353 offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys. WS353 can be used in fine pitch printing applications and

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WS353 SN100C® Water Soluble Solder Paste

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Description:

WS353 SN100C® water soluble solder paste has been developed in response to electronics manufacturers demand for an all-purpose, reliably consistent water-soluble solder paste. WS353 SN100C® offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys.

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WS353 Water Soluble Solder Paste Sn62 and Sn63

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Description

WS353 water soluble solder paste has been developed in response to electronics manufacturers demand for an allpurpose,reliably consistent water-soluble solder paste. WS353 offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys.

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NC257-2 SAC305 No Clean Lead-Free Solder Paste

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Description:

NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability of NC257-2 results in bright, smooth and shiny solder joints, and it has been specifically formulated to lower solder beading. It also offers very low post process residues, which remain crystal clear and easily probed even at the elevated temperatures required for today’s lead-free alloys.

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