AIM Solder Products & Fluxes Australia - 1300 738 250

Solder Paste

AIM Australia offers a wide variety of flux types and solder alloys, including Leaded Solder Paste alloys and Lead-Free Solder Paste alloys.
If you cannot find the product you are looking for, please send us a request.

AIM Australia's Lead-Free Solder Pastes are available in a variety of chemistries, alloys, powder mesh size, and packaging and offer the following features:

Excellent printability and tack force
Long tack time and stencil life
Excellent wetting and solderability
Low residues
Easily cleaned residues

Pass Bellcore and IPC reliability testing
Easily pin probe tested
High heat and humidity resistance
Suitable for high-speed printing
Eliminate solder defects such as voiding and solder beading

WS353 SAC305 Lead Free Water Soluble Solder Paste

Description:

WS353 water soluble solder paste has been developed in response to electronics manufacturers demand for an all-purpose, reliably consistent water-soluble solder paste. WS353 offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys. WS353 can be used in fine pitch printing applications and

WS353 SN100C® Water Soluble Solder Paste

Description:

WS353 SN100C® water soluble solder paste has been developed in response to electronics manufacturers demand for an all-purpose, reliably consistent water-soluble solder paste. WS353 SN100C® offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys.

WS353 Water Soluble Solder Paste Sn62 and Sn63

Description

WS353 water soluble solder paste has been developed in response to electronics manufacturers demand for an allpurpose,reliably consistent water-soluble solder paste. WS353 offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys.

NC257-2 SAC305 No Clean Lead-Free Solder Paste

Description:

NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability of NC257-2 results in bright, smooth and shiny solder joints, and it has been specifically formulated to lower solder beading. It also offers very low post process residues, which remain crystal clear and easily probed even at the elevated temperatures required for today’s lead-free alloys.