Sn50/Pb50 is locally manufactured Solder Bar of a high purity alloy that is composed of 50% tin and 50% lead. It is liquid at 216°C (421°F), solid at 183°C (361°F) and has a pasty range of 15°C (60°F).
This solder will produce a much "flatter" bead than the Sn60/Pb40. Because of its higher melting point, 50/50 solder is often used on the back (or inside) of a stained glass project to protect against "melt through" when soldering the front. Because it spreads and flattens out, 50/50 solder is often used when soldering lead came joints.
Features:
- High Purity
- Melting Temperature 185–216 °C (365–421 °F)
- Reduces Drossing
This alloy is also available in solid and cored wire, foil, spheres, preforms, powder, solder paste, ingot and anode form.
