DESCRIPTION
WS353 paste flux is an organically activated formulation composed of the same basic materials found in WS353 water-soluble solder paste, ensuring its compatibility. WS353 paste flux may be utilized for ball attach, flip chip, die attach, tinning, rework, and other standard paste flux applications. WS353 paste flux offers robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys. WS353 paste flux also provides an exceptional postprocess cleaning window and is designed to not foam during the cleaning process, even in high pressure wash systems. WS353 offers extended stencil life and tack time.
FEATURES
- HIGH ACTIVITY LEVEL • EXCELLENT WETTING
- IMPROVED ENVIRONMENTAL RESISTANCE
- EXTENDED CLEANING WINDOW
- FOR BALL ATTACH, FLIP CHIP, DIE ATTACH, TINNING, AND REWORK APPLICATIONS
- This material has a refrigerated shelf life of 6 months when packaged in jars or syringes.
- Do not store near fire or flame.
- Keep paste flux away from sunlight as it may degrade the product.
- WS353 paste flux can be applied either directly from syringes via dispensing needles or from other packages via acid brush or other applicator.
- Apply directly onto components, PCBs, or wires.
PACKAGING
WS353 paste flux comes standard in syringes, jars, and cartridges.
