Fluxes - No Clean

Flux is a chemical composition critical to soldering that:

  • Cleans metals surfaces to assist the flow of filler metals over base metals and provides a protective barrier against re-oxidation and heat scale.
  • Assists with heat transfer from heat source to metal surface.
  • Helps in the removal of surface metal oxides.

If you wish to No Clean Flux or any other solder assembly materials for the electronics industry, click the following link to access a list of AIM Products Australian Resellers or call us on 02 4735 3126

NC270WR VOC-Free No Clean Liquid Flux

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Description:

270WR is a VOC-free water-based, halide-free, no-clean liquid flux formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. 270WR offers a broad activation range, proving to be an excellent flux for a variety of process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys.

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NC266-3 No Clean Liquid Flux - Alcohol based

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Description:

NC266-3 is a rosin-free, resin-free, halide-free, no-clean wave solder flux designed to enhance wetting and prevent bridging during the wave soldering process. NC266-3 offers an enhanced activity level, as well as lower surface tension than other no-clean flux chemistries. NC266-3 performs well with bare copper, solder coated and organic coated PWBs, leaving negligible post-process residues that are non-conductive and do not require cleaning. NC266-3 may be utilized with tin-lead and lead-free solder alloys.

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NC264-5 No Clean Liquid Flux - Alcohol based

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Description:

NC264-5 is an alcohol-based no-clean liquid flux formulated to offer a very wide process window for lead-free and tin-lead wave soldering operations. NC264-5 offers faster wetting for SN100C® and SAC alloys than previously formulated fluxes and is compatible with a broad range of lead-free and tin-lead solder alloys. NC264-5 offers low post-process residues and has proven to reduce preventative maintenance requirements for spray fluxing applications. NC264-5 is designed to be a no-clean, non-visible residue flux, which can be cleaned if critical to the product application.

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NC265 No Clean Liquid Flux - Alcohol based

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Description:

NC265 is an alcohol-based no-clean liquid flux formulated to offer a very wide process window for lead-free and tin-lead wave soldering operations. NC265 offers faster wetting for SN100C® and SAC alloys than previously formulated fluxes and is compatible with a broad range of lead-free and tin-lead solder alloys. NC265 offers low post-process residues and has proven to reduce preventative maintenance requirements for spray fluxing applications. NC265 is designed to be a no-clean, non-visible residue flux, which can be cleaned if critical to the product application.

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NC254 - No-Clean Flux Paste / Gel

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Description:

NC254 paste flux is a mildly activated, resin-based formulation developed to offer a broad process window and pin-probeable residues. The superior wetting ability of NC254 results in bright, smooth, shiny, solder joints. NC254 offers very low post process residues, which remain crystal clear and probable even at the elevated temperatures required for today's lead free alloys.

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