DESCRIPTION
EPOXY 4044 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. EPOXY 4044 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, and quick cure properties when exposed to heat. Viscosity and surface tension of EPOXY 4044 are adequate for use with high speed placement equipment.
FEATURES
- FOR PRINTING AND DISPENSING APPLICATIONS
- FAST CURING
- ONE PART EPOXY • NON-STRINGING FORMULA
- GOOD FOR HIGH SPEED PLACEMENT EQUIPMENT
- HIGH SHEAR STRENGTH
*Passes Bellcore requirements; supporting data is available upon request.
CURING INSTRUCTIONS
APPLICATION
- EPOXY 4044 is delivered ready to use, and is available in syringes, cartridges, and jars.
- EPOXY 4044 may be applied with air pressurized, hand operated, or automated dispensing equipment, as well as positive displacement systems. Machine parameters should be optimized accordingly.
- For screening applications, clean screen or stencil and apply epoxy to screen in the same manner as solder paste.
- Adhesive dispense quality depends upon dispense pressure, time, nozzle size, and temperature.
- Bond strength will vary depending on component type, adhesive dot size, cure and type of solder mask or photo resist.
HANDLING
- This material has a shelf life of 6 months when stored at room temperature.
- Clean dispensing nozzles thoroughly after each use. Avoid leaving adhesive in nozzles for extended periods of time.
- Keep container sealed when not in use. Care should be taken not to allow product contamination or air entrapment when transferring to, or storing in, other containers.
- Do not mix new and used adhesive in the same container.
CLEANING
- Uncured adhesive may be removed from the pwb with IPA.
- Cured epoxy or removal of components bonded with EPOXY 4044 may be facilitated with the addition of heat from a heat gun or hot air jet. A temperature of approximately 120°C should be adequate.
