DESCRIPTION

Underfill 623 is a non-odorous, low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill 623 offers excellent capillary action for flat, fast and complete spread. Underfill 623 offers superior reliability through high Tg, low CTE, good fill, no voiding, compatibility with no-clean flux residues and excellent adhesion. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds. Underfill 623 may be reworked at 120°C. The viscosity of Underfill 623 remains stable throughout its shelf life. This product is suitable for bare chip protection in a broad variety of small die applications.

DESCRIPTION

Underfill 620 is a fast flowing liquid epoxy designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill 620 is designed to enhance solder joint reliability by minimizing induced stresses and providing improved temperature cycling performance and excellent chemical resistance. Underfill 620 offers superior reliability through high Tg, low CTE, good fill, no voiding, compatibility with no-clean flux residues and excellent adhesion.

DESCRIPTION

EPOXY 4044 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. EPOXY 4044 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, and quick cure properties when exposed to heat. Viscosity and surface tension of EPOXY 4044 are adequate for use with high speed placement equipment.