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Features:
· 8 HOUR STENCIL LIFE · SLUMP RESISTANT
· WIDE PROCESS WINDOW · 6 HOUR TACK TIME
· HIGH HUMIDITY RESISTANCE · AQUEOUS CLEAN WITH SAPONIFIER
· AIR REFLOW / NITROGEN NOT NECESSARY
* Passes BELLCORE and IPC, product testing data available upon request
Description:
291AX is a mildly activated resin-based formulation designed specifically to allow post-process residues to be left
on the PCB without degradation. 291AX has a wide process window uncommon to most no-clean solder pastes,
which allows it to accommodate a variety of environments and process applications. 291AX performs well in
continuous production, offering good slump resistance, high tack, and low post-process residues. This material
has been utilized on various assemblies with RF designs without cleaning; however, the compatibility of flux
residues on RF assemblies is strongly dependent upon circuitry design.
Standard Paste Composition:
| Application Method |
IPC Powder Type |
Metal Load |
| Standard Stencil Printing |
3 |
89.5%
|
| Fine Pitch Stencil Printing |
5 |
89% |
| Ultra-Fine Pitch Stencil Printing |
5 |
88.5% |
| Dispensing syringes |
3 |
85% |
| Note: These are typical starting guidelines. To achieve optimal performance, actual metal load and particle size may vary per process, application, and environment. |
Handling:
- 291AX has a refrigerated shelf life of 1 year, at 4°C or 40°F, and a non-refrigerated shelf life of 6 months at 22°C or 72°F. 291AX packaged in syringes must be refrigerated in order to avoid material separation. Do not freeze this product.
- Allow the solder paste to warm completely and naturally to ambient temperature (8 hours is recommended) prior to breaking the seal for use.
- Mix the product lightly and thoroughly for 1 to 2 minutes to ensure an even distribution of any separated material resulting from storage.
- Do not store new and used paste in the same container. Re-seal any opened containers while not in use. As the cap of the 500 gram jars is not a seal, replace the internal plug in conjunction with the cap to ensure the best possible seal.
Printer Setup:
Following are the suggested starting parameters for your screen printer. Some assumptions were made as to the printer types used in modern applications. Adjustments will vary between equipment, application and facility environment.
SNAP-OFF DISTANCE: ON CONTACT (0.00”)
SQUEEGEE PRESSURE: 0.75-1.5 LBS/IN. OF BLADE
PCB SEPARATION DISTANCE: 0.030-0.050”
SQUEEGEE STROKE SPEED: 0.5 - 6 IN/SEC * DEPENDENT ON PCB AND PAD DESIGNS
PCB SEPARATION SPEED SLOW-MEDIUM
Paste Application:
- Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle. A bead diameter of 1/2 to 5/8 inch is normally sufficient to begin.
- Apply small amounts of fresh solder paste to the stencil at frequent, controlled intervals to maintain paste chemistry and workable properties.
- Cleaning of your stencil will vary according to the application. Cleaning can be accomplished using AIM DJAW stencil cleaner. Use DJAW in moderation and remove any excess cleaner from stencil.
- 291AX provides the necessary tack time/force for today’s high speed placement equipment. Ensuring proper support and handling of PCB’s during assembly will enhance product performance and reliability.
Reflow Data:
Cleaning:
291AX can be cleaned, if necessary, with saponified tap water. AIMTERGE-520 is recommended. DI-water is recommended for the final rinse. A temperature of 100° -150° F is sufficient for removing any residues. An in-line or other pressurized spray cleaning system is suggested, but is not required.
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