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Features:
· Low Residue
· Excellent Wetting
· Good for Flip Chip / Die attach applications
· Aqueous Clean with Saponifier
· Air Reflow / Nitrogen Not Necessary
* Passes BELLCORE and IPC, and Northern Telecom’s copper mirror test; product testing results available upon request.
Description:
NC 293+ paste flux is a mildly activated, resin-based formulation developed to offer excellent activity and wetting characteristics (even for hard-to-wet materials such as palladium, Nickel / Gold, organic coatings etc), and superior slump resistance. NC 293+ also offers high humidity tolerance, cleanable, low post-process residues, and a chemistry developed for use in air reflow. NC293+ paste flux may be utilized for ball attach, flip chip, die attach, tinning, rework, and other standard paste flux applications. This material has been utilized on various assemblies with RF designs without cleaning; however, the compatibility of flux residues on RF assemblies is strongly dependent upon circuitry design.
Handling:
· " When packaged in jars this material has a shelf life 1 year refrigerated or 6 months at room temperature.
· When packaged in syringes this material has a shelf life 6 months refrigerated.
· Keep paste flux away from sunlight as it may degrade the product.
· Paste flux has a two-year shelf life when packaged in jars and a one-year shelf life when packaged in syringes or cartridges.
Flux Application:
· When being used for rework, application should be limited to the area being worked. Application via dispense needle, brush or a cotton swab is recommended.
Cleaning:
NC 293+ paste flux can be cleaned, if necessary, with saponified water or an appropriate solvent cleaner. Please refer to the AIM No-Clean-Cleaner Matrix for a list of suitable cleaning materials.
Packaging:
NC 293+ paste flux comes standard in syringes and jars.
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