Features:

• VOC-FREE
• ULTRA-LOW FUMING
• HALIDE-FREE · ENHANCED WETTING
  
  * Passes BELLCORE and IPC, supporting data is available upon request

Description:

NC 270 is an organically activated water-based, halide-free, no-clean flux formulated to fully atomize during the wave soldering process. NC 270 has enhanced wetting ability and a broad activation range, proving to be an excellent flux for bare copper, hot air leveled and organic coated circuit boards. NC 270 is designed to be a noclean, non-visible residue flux, which can be cleaned if critical to the product application. NC 270 has been utilised on various assemblies with RF designs without cleaning; however, the compatibility of flux residues on RF assemblies is strongly dependent upon circuitry design.

Physical Properties:

SOLIDS CONTENT: 4.4%
FLUX DENSITY: 1.01 ± .02
ACID VALUE: 35.3 MG KOH/GRAM ± 2

Handling:

· NC 270 has an unopened shelf life of 6 months when stored at room temperature.
· Keep away from sunlight as it may degrade the product. Do not store near fire or flame.
· NC 270 is shipped ready-to-use; no mixing is necessary.
· Do not mix used and unused chemical in the same container. Reseal any opened containers.

Flux Application:

· NC 270-S is ready to use directly from the container for spray systems. No thinning is required. NC 270-F is available for foaming applications. Both products may be thinned using deionized water if necessary.
· When spray fluxing, it is imperative that proper flux coverage and uniformity be achieved and maintained. A dry flux coating of 500 to 1500 micrograms per square inch is recommended as a starting point.
· When complete nitrogen sealed wave solder equipment is used, it is generally necessary to apply slightly more flux than normal as a result of excess drying due to the extended length of the equipment.

Process Control:

Because of the low percentage of solids found in NC 270, control of specific gravity with automated equipment is
usually found to be ineffective; therefore, control via titration is necessary. Titration is a more accurate method of
measuring the percentage of solids a low-solids solution. The acid number should be maintained between 33.3 –
37.3MG KOH/GRAM or 10-12 drops using AIM’s N.020 titration kit. Titration should be done at least once every two
hours, or more often if large variances are found.

NOTES:
· NC270 requires lower preheat temperature than most other VOC-Free liquid fluxes.
· Bottom side micro solder balls may result from excess preheat temperature.
· Reduce the preheat temperature to eliminate this problem.


Process Parameters:

· When spray fluxing, it is imperative that proper flux coverage be achieved and maintained.
· When nitrogen sealed wave solder equipment is used, it is generally necessary to apply slightly more flux than
normal because of the extended length of the equipment.
· When foam fluxing, it is most critical that proper drying methods be established. All moisture on the PCB must
be evaporated off prior to contacting the wave.


Flux Tech-Tips:

PROBLEM	POTENTIAL CAUSE
· BRIDGING:	INSUFFICIENT FLUX, EXCESSIVE PRE-HEAT, SOLDER CONTAMINATION
· BOTTOM SIDE MICRO BALLS:	EXCESS PREHEAT TEMPERATURE
· SOLDER BALLS:	LOW PREHEAT TEMPERATURE, EXCESS FLUX, WATER NOT FULLY EVAPORATED
· WHITE RESIDUE:	EXCESS FLUX, FLUX CONTAMINATION, SOLDER CONTAMINATION
· DISCOLORED JOINT:	SOLDER OXIDATION, BOARD/COMPONENT CONTAMINATION, EXCESSIVE HEAT


Cleaning:

NC 270 can be cleaned, if necessary, with water. Deionized water is recommended for the final rinse. A temperature of 100° - 150°F is sufficient for removing any residues. An in-line or other pressurized spray cleaning system is suggested, but is not required.

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