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Features
• Good Activity Level
• Glycol Free
• Mildly Activated Flux
• Good Thermal Transfer
• Good Wetting Properties
* Meets QQS-571-E Specification and Applicable IPC-J-STD-004 and -006 Requirements
Description:
RMA WIRE is a mildly activated, general-purpose wire solder for use in applications requiring good
activation. RMA cored wire is active enough for excellent tarnish or oxide removal, and will produce bright shiny solder joints. RMA wire will leave slight to moderate post-process residues that may be left on noncritical applications, but should be removed from any critical applications. RMA cored wire meets Mil-Spec cleanliness requirements without cleaning.
Handling:
• RMA cored wire has an indefinite shelf life when proper storage conditions are observed
• Store product in a clean dry area away from moisture and sunlight. Do not freeze this product.
Application:
• Solder iron tip temperature should be between 650° and 750°F for Sn63, Sn62 and Sn60 alloys, 700° - 800°F for Sn/Ag and Sn/Ag/Cu alloys and 650° to 700°F for Sn43/Pb43/Bi14.
• Hold the solder iron at a 45° to 60° angle to the work surface.
• The solder iron should contact both the component lead and PCB pad surface.
• Solder and flux should flow onto the lead and pad or lead and barrel to promote optimum flux activity to the joint being worked.
Cleaning:
• If post-process cleaning is desired, is easiest if performed within a two to three hour period post-process.
• Adequate cleaning may be accomplished using a saponifier. AIMTERGE-520A and ChemTools PCB Cleaners are recommended.
• A temperature of 100º-150ºF is sufficient for removing residues. An in-line or other pressurised spray cleaning system is suggested, but is not required.
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