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Features:
• EXCELLENT FATIGUE RESISTANCE
• LOW MELTING POINT FOR A PB-FREE ALLOY (217°C -218°C)
• EXCELLENT SOLDER JOINT RELIABILITY
• COMPATIBLE WITH ALL FLUX TYPES
Description:
SAC Alloys are the leading candidates to replace tin-lead solders for electronic assembly applications. SAC305 contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. These alloys have proven to perform very well in SMT, wave soldering, and hand soldering applications. SAC Alloys may be used with many existing equipment, processes, coatings, and flux chemistries. SAC Alloys are available in bar, cored wire, solid wire, foil, preforms, powder, and no-clean, water soluble and RMA solder pastes.
** AIM’s SAC Alloy no-clean solder pastes pass all Bellcore and IPC specifications.
Typical Impurity Levels:
Al: < 0.003%
Au: 0.05%
Cd: < 0.001%
Fe: 0.01%
In: 0.10%
As: < 0.01%
Bi: 0.01%
Zn: < 0.001%
Ni: < 0.003%
Pb: < 0.05%
Handling:
Refer to the specific Material Safety Data Sheet and the handling section of the individual Technical Data Sheets for the chemistry type of SAC Alloy solder paste being used.
Flux Compatibility:
SAC Alloys is compatible with all major electronic grade fluxes on the market today, and is available in paste and wire form in no-clean, water soluble and rosin chemistries.
Cleaning:
Refer to the liquid flux manufacturer’s data sheet for specific cleaning information, or refer to the cleaning section of the individual AIM solder paste technical data sheets for the recommended cleaning information.
Temperature Requirements:
Reflow Soldering: PEAK TEMPERATURE 235° - 245°C (455° - 473°F)
WAVE SOLDERING POT TEMPERATURE 265-270°C (520-530°F )
HAND SOLDERING TIP TEMPERATURE 370° - 425°C (700° - 800°F)
Safety:
• Use with adequate ventilation and proper personal protective equipment.
• Refer to the accompanying Material Safety Data Sheet for any specific emergency information.
• Do not dispose of any hazardous materials in non-approved containers.
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